8610-60G – NON-SILICONE HEAT TRANSFER COMPOUND.
Benefits of Non Silicone :
No migration and component
contamination.
Product Description
8610-60G
Non-Silicone Heat Transfer Compound.
Benefits of Non Silicone :
No migration and component
contamination.
Applications : used in
OEM Electronic Component Plants
to insure fast, accurate heat transfer
in electronic components & circuitry.
Semiconductor Mounting Devices.
Thermal joints. Ballast heat
transfer mediums. Power resistor
mountings. Thermocouple wells.
Transistor diodes & silicone rectifier
base and mounting studs. ALL
electric and electronic devices
where efficient heat transfer cooling
through thermal coupling is required